The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata's RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports ...
In the current investigation, the thermal and thermodynamic behavior of a buoyancy-driven evacuated tube solar collector (ETSC) has undergone precise evaluation, and the efficacy of nanoparticle ...
Deep-sea residual oil has been recognized as a significant environmental hazard due to its poor low-temperature fluidity and complex recovery processes necessitating urgent solutions. A segmented ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
With digital twins (virtual replicas of objects or systems) of capacitors, engineers can simulate system-level interactions ...
The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...
Heat management at the nanoscale has long been a cornerstone of advanced technological applications, ranging from high-performance electronics to quantum computing. Addressing this critical challenge, ...
There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
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