Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, ...

ACM Research, Inc ACMR reported fourth-quarter fiscal 2025 revenues of $244.43 million, beating the analyst consensus of $238.96 million. Revenues jumped 9.4% Y/Y. ACMR reported an adjusted EPS of 25 ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

SJ Semiconductor's listing highlights the growing role of chip packaging in China's strategy to narrow the technology gap ...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...

CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for soft-pad ...

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...

Advanced Chip Engineering Technology (ACE) has successfully run wafer-level packaging and testing for an 8-inch wafer of 64Mbit DRAM. The company has already acquired technical certification for its ...