Product Briefing Outline: ACI-ecotec GmbH & Co. KG has developed a new inline wafer separation system suitable for separating mono- and polycrystalline wafers in all common formats with thicknesses of ...

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

IMEC and Vrije Universiteit Brussel (VUB) built and demonstrated an on-wafer liquid phase chromatograph using sub-micron micromachining at last week's IEEE International Electron Devices Meeting. The ...

Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

Given the potential of nanofabricated membranes to advance macromolecular separation processes and the limitations of existing materials, we have developed a robust and inexpensive ultrathin porous ...