Hyperloop Transportation Technologies (HyperloopTT) has completed what it claims is the world’s first HyperPort feasibility study in Brazil, showing the transportation system as a potential ...

Backed by investments from the European Chips Act, research hub Imec is collaborating with Dutch semiconductor manufacturing tool giant ASML to become one of the first hubs to feature ASML’s full ...

Called the RZ/V2N, the MPU has an integrated AI accelerator, dynamically reconfigurable processor (DRP)-A13 that has 10 tera operations per second per watt (TOPS/W) power efficiency and an AI ...

Altera Corp., an Intel company, has unveiled three low-power field programmable gate arrays (FPGAs) that deliver up to 1.9 times higher fabric performance compared to previous generations. The company ...

Semtech Corp. has launched its first chip in the long range (LoRa) Plus family, a fourth-generation device that supports both terrestrial and SATCOM networks in the sub-GHz, 2.4 GHz ISM bands and ...

At next week’s APEX Expo 2025, Cybord will launch AI-powered real-time interception (RTI) software for electronic designs that can prevent defective components from being assembled onto a printed ...

Sager Electronics, a North American distributor of interconnect, power and electromechanical components and custom solutions ...

Aetina, a subsidiary of Innodisk Group and developer of edge artificial intelligence (AI) solutions, and Axelera AI, a ...

Additional new features now available in Oxion 2.0 include AI Design Explorer for adjusting antenna placement, dimensions and ...

Rohde & Schwarz and Ceva have unveiled the world’s first test solution supporting the upcoming Bluetooth over-the-air (OTA) ...

Anderson Power is excited to attend LogiMAT in 2025 and introduce the latest addition to its battery connector lineup: the ...

In the Google Pixel 9 Pro Fold, the smartphone includes four cameras ranging from 48 megapixels to 10 megapixels. It also ...